 |
Your search returned 11 records. Click on the hyperlinks to view further details of Titles.. |
|
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
|
Year : 1998 Volume number : 21 Issue: 02 |
Packaging Of Large-Scale Planar Lightwave Circuits
(Article)
Subject:
Arrayed Waveguide Gratings
,
Largest
,
Optical Materials
,
Planar Lightwave Circuits
Author:
K
Kato
M
Ishii
Yasuaki
Inoue
page:
121
-
129
Design And Qualification Of Hermetically Packaged Lithium Niobate Optical Modulator
(Article)
Subject:
Optical Modulator
,
Lithium Niobate
,
Hermetic Compressor
Author:
R. S.
Moyer
Frank F.
Judd
Richard C.
Kershner
page:
130
-
135
Wafer Scale Photonic-Die Attachment
(Article)
Subject:
Silicon Wafer
,
Passive Optical Networks (Pons)
Author:
Robert
Boudreau
Terry
Bowen
Ping
Zhou
page:
136
-
146
Microsystems And Wafer Processes For Volume Production Of Highly Reliable Fiber Optic Components For Telecom-And Datacom-Application
(Article)
Subject:
Microsystem Cad
,
Telecom And Datacom
Author:
Hans L.
Althaus
Wolfgang
Gramann
Klaus
Panzer
page:
147
-
156
Modeling, Simulation, And Measurement Of Mid-Frequency Simultaneous Switching Noise In Computer Systems
(Article)
Subject:
Computer System Performance Analysis
,
Mcm
,
Scm
,
Simultaneous Stron H Stabilization
Author:
Wiren D.
Becker
Jim
Eckhardt
Howard H.
Smith
page:
157
-
163
Comparison Of Electrical Performance Of Enhanced Bga'S
(Article)
Subject:
Comparison
,
Design
,
Noise
,
Package Modeling
Author:
Ravi
Kaw
Nur
Devnani
Bill
Hanna
page:
164
-
170
Characterization Of Thin Film Microstrip Lines On Polyimide
(Article)
Subject:
Microstrip
,
Microwave
,
Multilayer
,
Polyimide
Author:
George E.
Ponchak
Alan N.
Downey
page:
171
-
176
Accurate, Rapid, High Frequency Empirically Based Predictive Modeling Of Arbitrary Geometry Planar Resistive Passive Devices
(Article)
Subject:
Resistor
,
Thin Film
,
Serpentine
,
Scattering Parameters
Author:
Ravi
Poddar
Emily M.
Moon
Nan Marie
Jokerst
page:
177
-
183
A Novel Integrated Decoupling Capacitor For Mcm-L Technology
(Article)
Subject:
Barium Cerate
,
Decoupling Capacitor
,
Polynorbornene
Author:
Premjeet
Chahal
Mark G.
Allen
Madhavan
Swaminathan
page:
184
-
193
Laser Formed Metallic Connections
(Article)
Subject:
Interconnection Technologies
,
Metallization
,
Wafer Level Package
Author:
Joseph B.
Bernstein
W.
Zhang
Sitar
Nicholas
page:
194
-
198
Novel Technique For Measuring Through-Plane Modulus In Thin Polymer Films
(Article)
Subject:
Dielectric Constant
,
Elastic Modulus
,
Interdigitated Flow Field
,
Through-Plane Thermal
Author:
Kaushal S.
Patel
Paul A.
Kohl
Ann
Bidstrup-Allen
page:
199
-
202
|
|
| | |
